Shenzhen Key Laboratory of Key Technologies for High Density Electronic Packaging and Device Integration


Device for high density electronic packaging and integration of micro/nano materials preparation and performance optimization, the basis of the functional polymer synthesis and modification, around a flip chip, 3 d silicon hole, high density board, integration, thermal interface materials for embedded device key technology, high density system level packaging for all kinds of key materials and devices integration, process and key technology research and development equipment. The research direction of key laboratory covers three common aspects: basic research, core technology development and industrialization technology attack.

Main Research Projects


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