Guangdong Key Laboratory of High Density Electronic Packaging Materials


This lab is to key materials for high density electronic packaging the key scientific problems to carry out the research work, perfect our country electronic encapsulation materials discipline layout, and to our country industry in urgent need of the bottom of the flip chip packing, 3 d silicon hole high-speed polymer insulating materials, high frequency substrate materials, advanced packaging photoresist materials for breakthrough and development of a number of with independent intellectual property rights of new materials and new technology.

Main Research Projects


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