SIAT-CUHK Joint Laboratory of High Density Electronic Packaging Materials and Devices


With advanced electronic packaging materials and complete process as the core, the laboratory focuses on key scientific issues such as electrical, thermal and mechanical properties of electronic packaging materials, including key materials for high density flip chip, high performance thermal interface materials, key materials for 3D IC interconnection integration, embedded functional materials, high density high frequency substrate base materials. Material and process for air-tight packaging. Based on basic research, we spare no effort in industrialization.

Main Research Projects


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